stormvogel schreef op 30 september 2014 14:01:
RoodMicrotec seminar:
Printed circuit assembly failures and their prevention
On 16 October, RoodMicrotec will organise a seminar on this theme, which will provide valuable scientific and practical insights into
diagnosing and preventing failures in printed circuit assemblies.
Device processing at PCA level contains numerous risks of early failures or reduced reliability. One major factor is the manufacturing
process, which comprises for instances soldering, cleaning, vanishing or encapsulating steps. Another major factor are the rules
determining the layout of the device (e.g. capacitors, inductors or push-buttons) and the design of the interfaces.
The continuously increasing complexity and miniaturization of the designs requires that further consideration be given to external
influences such as electrostatic discharge (ESD) or environmental factors. Further topics covered in this seminar are cooling, minimum
distances between PCB tracks, quality metrics of the PCB as well as interface design for high voltage operation.
Finally, typical failure patterns and methods recognising these patterns will be presented.