beeldscherm schreef op 27 juli 2011 11:06:
Flip chip defies semiconductor downturn
26 July 2011
THE INFORMATION Network reports that semiconductor advanced packaging is growing at a 18 percent compounded annual rate.
The report, titled Lithography and Etch Market Analysis for Flip Chip Manufacturing, points to a downturn in semiconductor equipment sales for the second half of 2011 and through 2012, but not all semiconductor equipment markets are subject to this trend.
Flip chip technology, an advanced form of packaging of ICs, is projected to show strength even in the face of a faltering equipment market.
Total flip chip sales represented 11 percent of worldwide IC production in 2010 but will grow to more than 18 percent in 2015. Just six years ago, in 2005, flip chip comprised only 5 percent of IC production.
In advanced packaging, Intel is the leader, followed by Chipbond Technology, TSMC, Samsung, NEPES, and ASE.
Sputtering and copper electrodeposition equipment, main sectors of the flip chip equipment market, will exhibit a compounded annual growth rate of 17 percent.
Companies, recognising the trend, are making strategic investments in developing equipment for flip chip. Lam Research purchased SEX in 2008, while Applied Materials acquired Semitool in 2009.
The growth of flip chip technology is attributed to its edge over traditional wire-bond packaging, with superior thermal and electrical performance.
In the world of high-speed/high-performance IC and package design, flip chips are appearing in growing numbers of high-volume consumer products such as mobile phones, digital cameras, MP3 players, and computing.
For example, in the Apple iPad, 20 percent of the ICs on the motherboard are made up of flip chip markets
wie was ook alweer Wereldmarktleider Flip-Chip...
www.i-micronews.com/upload/Interviews...