groene appel schreef op 8 april 2022 11:40:
? Semiconductor assembly has moved from individual chip component circuitry to integration on
chip level via hybrid bonding. Gating item for semiconductor development
? Hybrid bonding adoption has become most critical element to increasing circuitry speed and
further reducing cost
? Has potential to become leading technology for <7nm nodes
? Will coexist with TCB/advanced flip chip and drive growth of high end assembly equipment market
? All leading semiconductor producers evaluating technology
? Market has potential to significantly exceed initial expectations
? Besi has a leading position with competitive advantage
• Initial proof-of-concept orders received in Spring 2021
• Additional orders received in both Q2 and Q3-21 for delivery in H1-22
• Shipments Commenced in Q4-21
• Cluster tools available in Q2-22 to help support volume production
• Multiple customer engagements
• Expanded R&D teams in Europe and Singapore
• Added clean room production facilities in Malaysia and Austria (2021)
• Building capacity to produce 12-15 systems per month
• Engineers and software developers hired for US and Taiwan support